KLA Corporation Leads Semiconductor Innovation With New IC Substrate Portfolio
$KLAC
KLA Corporation (NASDAQ:KLAC) has announced the launch of an extensive portfolio of process control and enabling solutions specifically designed for integrated circuit (IC) substrate manufacturing, marking a significant development in semiconductor packaging technology. This new portfolio, unveiled on October 15, stands as the most comprehensive collection of solutions in the industry, aimed at addressing the increasing demands for high-performance applications through innovative packaging interconnect density.
Among the newly introduced solutions are the Corus™ and Serena™ direct imaging platforms, as well as the Lumina™ inspection and metrology systems.These innovations are poised to transform the manufacturing processes for IC substrates, including those featuring glass cores and panel-based interposers. The focus is on enhancing product quality and yield while optimizing the overall cost of ownership.
The Corus™ platform, recognized for its adaptability and efficiency, has been upgraded with next-generation optics and lasers to meet the evolving requirements of high-density interconnect and IC substrate applications. Additionally, the Serena™ platform introduces a groundbreaking solution for large-sized, high-layer-count organic substrates, enhancing both accuracy and yield through a flexible digital approach.
The direct imaging technology presented with these platforms moves beyond traditional lithographic steppers, specifically designed for advanced applications. Complementing this suite is the Lumina™ system, which offers high-sensitivity detection and scanning metrology. This system is seamlessly integrated with KLA’s copper shaping solutions and employs AI-driven review and classification processes to provide actionable insights without manual oversight, thereby streamlining the defect management process in IC substrate manufacturing.
Oreste Donzella, Executive Vice President and Chief Strategy Officer at KLA Corporation, emphasized the strategic significance of these innovations. He stated, “IC substrates and other panel-level packaging technologies are essential to advancing connectivity within tomorrow’s high-performance chips.” Donzella highlighted KLA’s collaborative approach with customers to tackle complex production challenges, maximizing yield and driving business success.
This strategic expansion of KLA’s product offerings underscores its leadership within the semiconductor ecosystem and its dedication to meeting the intricate demands of modern IC manufacturing. The company’s solutions are crucial for enabling manufacturers to achieve higher yields, accelerate delivery cycles, and enhance profitability amidst the challenges posed by increasing package complexity and material innovation.
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